Machines, cutting tools and contract processing for optics, semiconductors, electronics, automotive and more. From prototype to series — without micro-cracks.
Order reflects strategic priority, not the alphabet.
Optical & special glass — drilled and cut without micro-cracks.
ExploreCarrier, cover and equipment glass — from 30 µm.
ExploreThin glass, touch and cover glass.
ExploreSensor & display glass.
ExploreExisting strength.
ExploreExisting strength.
ExploreThe low-barrier way in: we process your parts on MDI’s own laser machines — prototype, small batch or recurring series — without the capital investment of buying a system. Send us your drawing and we handle the rest.
Send us your specification →Links to the existing process pages — URLs unchanged, rankings preserved.
