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Industries · Display & Electronics

Laser processing for display & electronics glass

Cutting, drilling and structuring of thin glass, cover glass and touch-sensor glass — clean, chip-free edges and tight tolerances, from prototype to series.

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Applications

What we process for display & electronics

From cover glass to touch sensors — contactless laser processing keeps edges clean and coatings intact.

Cover glass cutting

Free-form contours and cut-outs with chip-free edges.

Touch sensor glass

Fine structuring and singulation without micro-cracks.

Precision holes & cut-outs

Camera and speaker openings, contactless.

Thin-glass singulation

Clean separation of ultra-thin substrates.

Key specifications

Process window

0.056 mmglass thickness
±25 µmaccuracy
Chip-freeedge quality
Boro · float · specialglass types
Application example

Cover glass, cut chip-free

Material: 0.7 mm borosilicate cover glass. Task: a free-form outline with two camera cut-outs, in prototype volumes. Result: contactless laser cutting with chip-free edges — no grinding step, first samples in days.

Contract processing

From prototype to series — without a machine of your own

Cover-glass and sensor prototypes on MDI’s laser machines, scaling into series without a new supplier or qualification cycle.

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Let’s talk

Thin or cover glass to process? Let’s talk.

Send us your specification →
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