{"id":1150,"date":"2026-09-12T12:03:34","date_gmt":"2026-09-12T12:03:34","guid":{"rendered":"https:\/\/www.mdi-ap.com\/?page_id=1150"},"modified":"2026-09-12T12:03:34","modified_gmt":"2026-09-12T12:03:34","slug":"semiconductors","status":"publish","type":"page","link":"https:\/\/www.mdi-ap.com\/en\/semiconductors\/","title":{"rendered":"Semiconductors"},"content":{"rendered":"<div class=\"ip\">\n<div class=\"ip\">\n<div class=\"ip\">\n<style> .ip{--navy:#02203c;--navy2:#0b3157;--red:#80262f;--red2:#ad0c26;--red-lt:#e2564f;--blue:#5897fb;--ink:#02203c;--muted:#5e6467;--line:#e2e5ea;--paper:#f5f7f9; color:var(--ink);font-family:\"Source Sans Pro\",\"Segoe UI\",-apple-system,Roboto,Arial,sans-serif;font-size:16px;line-height:1.6;overflow-x:clip;} .ip *{box-sizing:border-box;} .ip img{max-width:100%;} .ip h1,.ip h2,.ip h3,.ip h4{color:inherit;font-family:inherit;} .middle-section{padding:0!important;} .middle-section .container{max-width:none!important;padding:0!important;} 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.ip-band::before{content:\"\";position:absolute;inset:0;opacity:.08;background-image:radial-gradient(circle at 1px 1px,#fff 1px,transparent 0);background-size:26px 26px;} \/* POSTS *\/ .ip-postgrid{display:grid;grid-template-columns:repeat(auto-fit,minmax(260px,1fr));gap:20px;} .ip-pcard{display:flex;flex-direction:column;border-radius:16px;overflow:hidden;background:#fff;border:1px solid var(--line);text-decoration:none;color:inherit;transition:transform .2s,box-shadow .2s;} .ip-pcard:hover{transform:translateY(-6px);box-shadow:0 22px 44px rgba(20,22,26,.14);} .ip-pcard .ph{aspect-ratio:16\/10;overflow:hidden;background:#eceef1;} .ip-pcard .ph img{width:100%;height:100%;object-fit:cover;transition:transform .5s;} .ip-pcard:hover .ph img{transform:scale(1.07);} .ip-pcard .pb{padding:18px 20px 22px;} .ip-pcard .pt{font-size:11px;font-weight:800;letter-spacing:.12em;text-transform:uppercase;color:var(--red);margin-bottom:8px;} .ip-pcard h3{font-size:16px;font-weight:700;line-height:1.35;margin:0;} .ip-note{background:var(--paper);border:1px dashed var(--line);border-radius:14px;padding:22px 24px;color:var(--muted);font-size:14.5px;} .ip-close{text-align:center;padding:74px 0;background:var(--paper);} .ip-close h2{font-size:clamp(22px,2.8vw,34px);font-weight:800;margin:0 auto 20px;max-width:24ch;} .ip-btn.outline-red{background:transparent;color:var(--red);border:1.6px solid var(--red);} .ip-btn.outline-red:hover{background:var(--red);color:#fff;} @media(max-width:760px){.ip-two{grid-template-columns:1fr;}.ip-section{padding:56px 0;}} <\/style>\n<section class=\"ip-hero ip-bleed\">\n<div class=\"bg\" style=\"background-image:url(\/wp-content\/uploads\/2026\/09\/semiconductor-glass-chip.jpg)\"><\/div>\n<div class=\"ip-hero-in\">\n<div class=\"ip-crumb\">Home &rsaquo; Industries &rsaquo; <b>Semiconductors<\/b><\/div>\n<div class=\"ip-eyebrow on-dark\" style=\"margin-top:14px;\">Industries \u00b7 Semiconductors<\/div>\n<h1>Glass components for semiconductor manufacturing<\/h1>\n<p>Heat, plasma and chemistry: in semiconductor manufacturing, glass components must deliver process stability without contamination. MDI processes carrier, cover and equipment glass &mdash; for semiconductor manufacturing equipment and wafer processing, from 30&nbsp;\u00b5m, from prototype to series.<\/p>\n<p> <a class=\"ip-btn solid\" href=\"\/en\/prototyping\/\">Send us your specification &rarr;<\/a> <\/div>\n<\/section>\n<section class=\"ip-section\">\n<div class=\"ip-wrap\">\n<div class=\"ip-head ip-reveal\">\n<div class=\"ip-eyebrow\">Applications<\/div>\n<h2 class=\"ip-h2\">What we supply for semiconductor manufacturing<\/h2>\n<p class=\"ip-sub\">Glass components across the semiconductor value chain &mdash; from ultra-thin glass carriers to precision parts for fab equipment, with traceability built in.<\/p>\n<\/div>\n<div class=\"ip-grid\">\n<div class=\"ip-card ip-reveal\">\n<div class=\"ic\"><svg viewBox=\"0 0 24 24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"1.8\"><path d=\"M3 7l9-4 9 4-9 4z\"\/><path d=\"M3 12l9 4 9-4M3 17l9 4 9-4\"\/><\/svg><\/div>\n<h3>Ultra-thin glass<\/h3>\n<p>Laser cutting from 30&nbsp;\u00b5m (CO2); SOLID-D&reg; cutting tools for glass up to 100&nbsp;\u00b5m &mdash; carriers, cover glasses, spacers. Fast-growing market context: high-index glass wafers for AR waveguide manufacturing.<\/p>\n<\/div>\n<div class=\"ip-card ip-reveal\">\n<div class=\"ic\"><svg viewBox=\"0 0 24 24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"1.8\"><path d=\"M4 20 20 4M14 4h6v6\"\/><path d=\"M4 14v6h6\"\/><\/svg><\/div>\n<h3>Traceability<\/h3>\n<p>In-glass data matrix marking with 20&nbsp;\u00b5m feature size.<\/p>\n<\/div>\n<div class=\"ip-card ip-reveal\">\n<div class=\"ic\"><svg viewBox=\"0 0 24 24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"1.8\"><path d=\"M13 2 4 14h6l-1 8 9-12h-6z\"\/><\/svg><\/div>\n<h3>Coating removal &amp; patterning<\/h3>\n<p>Selective, layer-accurate ablation on coated glass.<\/p>\n<\/div>\n<div class=\"ip-card ip-reveal\">\n<div class=\"ic\"><svg viewBox=\"0 0 24 24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"1.8\"><circle cx=\"12\" cy=\"12\" r=\"9\"\/><circle cx=\"12\" cy=\"12\" r=\"2\"\/><\/svg><\/div>\n<h3>Components for fab equipment<\/h3>\n<p>Laser drilling from &Oslash;&nbsp;1&nbsp;mm, stepped holes and inside contours.<\/p>\n<\/div>\n<\/div><\/div>\n<\/section>\n<section class=\"ip-section paper\">\n<div class=\"ip-wrap\">\n<div class=\"ip-head ip-reveal\">\n<div class=\"ip-eyebrow\">Market &middot; Advanced packaging<\/div>\n<h2 class=\"ip-h2\">Glass is moving into the package<\/h2>\n<p class=\"ip-sub\">Advanced semiconductor packaging is shifting towards glass: glass core substrates, panel-level packaging (PLP), carrier wafers for heterogeneous integration and co-packaged optics &mdash; driven by AI and high-performance computing chips. Leading chip and substrate makers are investing in glass-core technology. This transition makes precision glass processing the decisive link: singulation, edge quality, splinter-free cutting of thin panels, and the handling components around the process.<\/p>\n<p class=\"ip-sub\"><b>Part of the value chain.<\/b> The next package generation is built in collaboration across the semiconductor value chain &mdash; material makers, substrate developers and processing partners. MDI is the processing link: singulation, edge processing, prototypes and small series. The collaboration starts before the first series specification &mdash; send us yours.<\/p>\n<\/p><\/div>\n<\/p><\/div>\n<\/section>\n<section class=\"ip-specs ip-bleed\">\n<div class=\"ip-specs-in ip-wrap\">\n<div class=\"ip-head ip-reveal\" style=\"margin-bottom:24px;\">\n<div class=\"ip-eyebrow on-dark\">Key specifications<\/div>\n<h2 class=\"ip-h2\" style=\"color:#fff;\">Process window<\/h2>\n<\/div>\n<div class=\"ip-specgrid ip-reveal\">\n<div class=\"ip-spec\"><b>from 30<span class='u'> \u00b5m<\/span><\/b><span>ultra-thin glass cutting<\/span><\/div>\n<div class=\"ip-spec\"><b>&Oslash; &ge; 1<span class='u'> mm<\/span><\/b><span>laser-drilled holes<\/span><\/div>\n<div class=\"ip-spec\"><b>20<span class='u'> \u00b5m<\/span><\/b><span>marking feature size<\/span><\/div>\n<div class=\"ip-spec\"><b>&gt; 200<span class='u'> MPa<\/span><\/b><span>bending strength after cutting, depending on glass thickness<\/span><\/div>\n<\/div><\/div>\n<\/section>\n<section class=\"ip-section paper\">\n<div class=\"ip-wrap\">\n<div class=\"ip-head ip-reveal\">\n<div class=\"ip-eyebrow\">Relevant technologies<\/div>\n<h2 class=\"ip-h2\">Which process applies<\/h2>\n<p class=\"ip-sub\">Links to the existing process pages &mdash; URLs unchanged.<\/p>\n<\/div>\n<div class=\"ip-grid\"><a class=\"ip-card ip-reveal\" href=\"\/en\/thin-glass\/\"><\/p>\n<div class=\"ic\"><svg viewBox=\"0 0 24 24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"1.8\"><path d=\"M3 7l9-4 9 4-9 4z\"\/><path d=\"M3 12l9 4 9-4M3 17l9 4 9-4\"\/><\/svg><\/div>\n<h3>Thin glass<\/h3>\n<p>Ultra-thin substrates from 30 \u00b5m.<\/p>\n<p><span class=\"ip-cardlink\">Learn more<\/span><\/a><a class=\"ip-card ip-reveal\" href=\"\/en\/co2-laser\/\"><\/p>\n<div class=\"ic\"><svg viewBox=\"0 0 24 24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"1.8\"><path d=\"M3 8c3 0 3 2 6 2s3-2 6-2 3 2 6 2M3 14c3 0 3 2 6 2s3-2 6-2 3 2 6 2\"\/><\/svg><\/div>\n<h3>CO2 laser<\/h3>\n<p>Cutting of thin and ultra-thin glass.<\/p>\n<p><span class=\"ip-cardlink\">Learn more<\/span><\/a><a class=\"ip-card ip-reveal\" href=\"\/en\/green-laser\/\"><\/p>\n<div class=\"ic\"><svg viewBox=\"0 0 24 24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"1.8\"><path d=\"M13 2 4 14h6l-1 8 9-12h-6z\"\/><\/svg><\/div>\n<h3>Green laser<\/h3>\n<p>Coating ablation and fine marking.<\/p>\n<p><span class=\"ip-cardlink\">Learn more<\/span><\/a><a class=\"ip-card ip-reveal\" href=\"\/en\/cutting-tools\/\"><\/p>\n<div class=\"ic\"><svg viewBox=\"0 0 24 24\" fill=\"none\" stroke=\"currentColor\" stroke-width=\"1.8\"><circle cx=\"6\" cy=\"6\" r=\"3\"\/><circle cx=\"6\" cy=\"18\" r=\"3\"\/><path d=\"M8.5 7.5 20 18M8.5 16.5 20 6\"\/><\/svg><\/div>\n<h3>Cutting tools<\/h3>\n<p>SOLID-D&reg; wheels for glass up to 100 \u00b5m.<\/p>\n<p><span class=\"ip-cardlink\">Learn more<\/span><\/a><\/div>\n<\/p><\/div>\n<\/section>\n<section class=\"ip-section\">\n<div class=\"ip-wrap\">\n<div class=\"ip-two ip-reveal\">\n<div class=\"ph\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/2026\/09\/glass-inside-contour.jpg\" alt=\"\"><\/div>\n<div>\n<div class=\"ip-eyebrow\">Application example<\/div>\n<h2>Precision components for fab equipment<\/h2>\n<p><b>Material:<\/b> glass, t&nbsp;=&nbsp;4&nbsp;mm. <b>Geometry:<\/b> inside contour 58&nbsp;&times;&nbsp;58&nbsp;mm, stepped holes and laser-drilled holes from &Oslash;&nbsp;1&nbsp;mm. <b>Result:<\/b> contactless processing without micro-cracks &mdash; example geometry from the MDI application portfolio.<\/p>\n<\/div><\/div>\n<\/p><\/div>\n<\/section>\n<section class=\"ip-section paper\">\n<div class=\"ip-wrap\">\n<div class=\"ip-head ip-reveal\">\n<div class=\"ip-eyebrow\">FAQ<\/div>\n<\/div>\n<h2 class=\"ip-h2\" style=\"font-size:22px;margin:0 0 8px;\">Can you process fused quartz \/ fused silica components?<\/h2>\n<p class=\"ip-sub\" style=\"margin:0 0 26px;\">Suitability depends on the material and the geometry of the part. Send us your specification &mdash; we will assess it and get back to you.<\/p>\n<h2 class=\"ip-h2\" style=\"font-size:22px;margin:0 0 8px;\">Do you process glass core substrates or panel-level packaging formats?<\/h2>\n<p class=\"ip-sub\" style=\"margin:0;\">That depends on format, thickness and process step. Send us your specification &mdash; we will assess feasibility case by case.<\/p>\n<\/p><\/div>\n<\/section>\n<section class=\"ip-band ip-bleed\">\n<div class=\"ip-band-in ip-wrap ip-reveal\">\n<div class=\"ip-eyebrow on-dark\" style=\"color:rgba(255,255,255,.85)\">Contract processing<\/div>\n<h2>Glass components from prototype to series<\/h2>\n<p>Carriers, covers and equipment parts on MDI&rsquo;s own laser and cutting-wheel systems &mdash; low volumes, frequent iteration, no capital commitment. Send a drawing and we handle the rest.<\/p>\n<p> <a class=\"ip-btn solid\" href=\"\/en\/prototyping\/\">Send us your specification &rarr;<\/a> <\/div>\n<\/section>\n<section class=\"ip-section\">\n<div class=\"ip-wrap\">\n<div class=\"ip-head ip-reveal\">\n<div class=\"ip-eyebrow\">Insights<\/div>\n<h2 class=\"ip-h2\">From the MDI blog<\/h2>\n<\/div>\n<div class=\"ip-postgrid\"><a class=\"ip-pcard ip-reveal\" href=\"\/en\/laser-cutting-optical-glass\/\"><\/p>\n<div class=\"ph\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/2026\/07\/Optiken-scaled-e1782986837464-768x803.jpg\" alt=\"\"><\/div>\n<div class=\"pb\">\n<div class=\"pt\">Optics<\/div>\n<h3>Optics by Laser: From the First Lens to Modern Optical Components<\/h3>\n<\/div>\n<p><\/a><a class=\"ip-pcard ip-reveal\" href=\"\/en\/when-capital-budgets-are-frozen-the-work-doesnt-have-to-stop\/\"><\/p>\n<div class=\"ph\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/2023\/05\/Logo_in_Glass.png\" alt=\"\"><\/div>\n<div class=\"pb\">\n<div class=\"pt\">Contract processing<\/div>\n<h3>When capital budgets are frozen, the work doesn&rsquo;t have to stop<\/h3>\n<\/div>\n<p><\/a><a class=\"ip-pcard ip-reveal\" href=\"\/en\/reduce-glass-chipping-guide\/\"><\/p>\n<div class=\"ph\"><img decoding=\"async\" src=\"\/wp-content\/uploads\/2026\/04\/Screenshot-2026-04-28-at-13.13.55.png\" alt=\"\"><\/div>\n<div class=\"pb\">\n<div class=\"pt\">Edge quality<\/div>\n<h3>How to Reduce Chipping in Glass Cutting<\/h3>\n<\/div>\n<p><\/a><\/div>\n<\/p><\/div>\n<\/section>\n<section class=\"ip-close ip-bleed\">\n<div class=\"ip-wrap ip-reveal\">\n<div class=\"ip-eyebrow\">Let&#8217;s talk<\/div>\n<h2>Glass components for your process? Let&rsquo;s talk.<\/h2>\n<p> <a class=\"ip-btn outline-red\" href=\"\/en\/prototyping\/\">Send us your specification &rarr;<\/a><\/div>\n<\/section>\n<p> <script> (function(){var r=document.querySelector('.ip');if(!r||!('IntersectionObserver' in window))return; var io=new IntersectionObserver(function(es){es.forEach(function(e){if(e.isIntersecting){e.target.classList.add('ip-in');io.unobserve(e.target);}});},{threshold:.12}); r.querySelectorAll('.ip-reveal').forEach(function(el,i){el.style.transitionDelay=(Math.min(i,6)*40)+'ms';io.observe(el);});})(); <\/script> <\/div>\n","protected":false},"excerpt":{"rendered":"<p>Home &rsaquo; Industries &rsaquo; Semiconductors Industries \u00b7 Semiconductors Glass components for semiconductor manufacturing Heat, plasma and chemistry: in semiconductor manufacturing, glass components must deliver process stability without contamination. MDI processes carrier, cover and equipment glass &mdash; for semiconductor manufacturing equipment and wafer processing, from 30&nbsp;\u00b5m, from prototype to series. Send us your specification &rarr; Applications [&hellip;]<\/p>\n","protected":false},"author":5,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"_yoast_wpseo_title":"Glass processing for semiconductor manufacturing & advanced packaging | MDI","_yoast_wpseo_metadesc":"Glass processing for semiconductor manufacturing & advanced packaging: glass carriers from 30 \u00b5m, laser drilling from \u00d8 1 mm, in-glass traceability marking.","inline_featured_image":false,"jobshop_section_title":"","jobshop_section_text":"","jobshop_section_button_label":"","jobshop_section_button_link":"","footnotes":""},"class_list":["post-1150","page","type-page","status-publish","hentry"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Glass processing for semiconductor manufacturing &amp; advanced packaging | 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